A complete machine enclosure allows very demanding applications in a controlled environment.ĭepending on the requirements, the modular FINEPLACER® femto 2 can be individually configured and retrofitted at any time to support new applications and technologies. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm 3 sigma. At its introduction, this innovative platform was awarded with the prestigious Swiss Technology Award.įINEPLACER® femto 2 Automated sub-micron Die Bonder It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership.
The Die Bonder Esec 2100 xP plus is the the 2 ndgeneration of the most flexible 300 mm high speed platform, capable of running the full range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA.
The Datacon 2200 evo plus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership.īesides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the Datacon 2200 evo is prepared for present and future processes and products. The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Test Handlers, Test interfaces, Manipulators.
IC Characterization and Functional Evaluation Test System.DC, RF, Resistivity probes and probe cards.
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